IA Resilience call reinforcing Europe's strenght in power electronics

About this call

Scope:

Proposals innovations should address one or more of the several domains :

WBG substrates to reduce EU dependency on material and provide more sustainable, industrially compatible solutions.

WBG platform for cost effectiveness, available in 300mm for GaN and/or SiC to improve yield and power density and close gaps in the value chain.

A toolbox (e.g. wafer cut, smart stacking, thin layer transfer, epitaxy, UWBG materials) for further innovation schemes.

Next generation or optimised new power semiconductor devices fitting their application.

Adding intelligence to power semiconductor devices on control and/or sensor side.

Facilitate the propagation of EU Packaging/Integration excellence along the entire value chain e.g. pre-packages or power semiconductor device packaging solutions to enable power device/system integration and strengthen Europe’s competitiveness in advanced packaging.

Explore the use of heterogeneous and functional integration for improved performance, reliability, robustness and cost competitiveness. Rising operative voltage, frequency, current and thermal features that are common challenge on power electronics across the different application sectors. Provide stable and clean power supply that minimises disruptions, equipment failures, and data corruption.

Advanced characterization techniques for new materials, devices, and systems.

Implement AI at system level and/or make use of AI methods to increase the innovation speed.